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10 Layer Flex Circuit Board Bonded Together

At Rigiflex, we get a number of clients who consistently enquire about multilayered flex PCBs. The advances in resin technology and utilization of high grade prepreg have allowed us to steadily meet this demand. In our 10 layer flex PCBs, we utilize prepreg glass cloth sheets and copper foils for the outer levels. We then create the layers, interchanging between pretreated cores and prepreg.

We utilize high quality presses to bond the layers together. The 10 layer stack is first placed under a press to pin the baseplates and the stack together. The PCB is then placed in a bonding press, which uses heat and pressure to bond the layers together. The heat cures the resin in the prepreg and the pressure bonds the various layers.

10 Layer Flex Circuit Board Bonded Together
Model:flex board-10L
Layers:10
Material:FR4+Polyimide
Surface treatment:immersion gold
Width/space:4/3mil
Finish thickness:0.15mm(flex),1.6mm
Min Hot:0.25mm

 

OEM Custom Service
Board Thickness0.5mm~3.0mm (0.02″~0.12″)
Copper thickness:0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline:Routing, punching, V-Cut
Solder mask:White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color:Black/White
Surface finishing:Immersion Gold, HASL, OSP
Max Panel size:18″*24″
Packing:Vacuum/Plastic bag
Layer:1 – 20 layers

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