(714) 688-1500 pcboards@rigiflex.com
Flex & Rigid-Flex PCBs.. 1-5 Day Quick Turn
Flex & Rigid-Flex PCBs.. 1-5 Day Quick Turn
Superior & Trusted Flexible, Rigid-Flex & Rigid PCBs for 25 years
Coverlay is basically a film or adhesive that is used to cover and protect conductive circuit patterns. Cover lays are generally found in flexible PCBs though they are also used in rigid-flex PCBs. They are particularly useful for large clusters of conductive circuits. They can also be used to outline the areas that require solder coating. Rigiflex offers a variety of options for the solder coating process. Our solder mask options include black, blue, green, white, and red. We also offer special type of Taiyo PSR4000 white solder masks for more specialized designs. The use of these cover lays results in an insulation resistance of over 1000MW in our PCBs.
| 10 Layer Rigid-Flex PCB with Selective Coverlay | |
| Model: | Rigid Flex PCB |
| Material: | FR4+PI |
| Surface treatment: | immersion gold |
| 4/4mil | |
| Finish thickness: | 0.2mm(flex), 1.6mm |
| Min Hot: | 0.1mm |
| OEM Custom Service | |
| Board Thickness | 0.5mm~3.0mm (0.02″~0.12″) |
| Copper thickness: | 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ |
| Outline: | Routing, punching, V-Cut |
| Solder mask: | White/Black/Blue/Green/Red, Taiyo PSR4000 white |
| Legend/Silkscreen Color: | Black/White |
| Surface finishing: | Immersion Gold, HASL, OSP |
| Max Panel size: | 18″*24″ |
| Packing: | Vacuum/Plastic bag |
| Layer: | 1 – 20 layers |
SPECIFICATION | ||||
Materials | Polyimide | Polyester ( PET) | Remark& | |
(Kapton) | Test Method | |||
| 1~20(Rigid-Flex & | 1~2 |
| |
Single Sided | 0.050 mm |
| ||
Double Sided | 0.075 mm |
| ||
Drilling P.T.H. | 0.2 mm |
| ||
Punching | 1.0 mm |
| ||
Conductor Width | 0.025 mm | W0.5mm | ||
Hole Diameter (H) | 0.05 mm | H1.5mm | ||
Accumulated Pitch | 0.05 mm | P25mm | ||
Outline Dimension | 0.05 mm | L50 mm | ||
Conductors and Outline | 0.15 mm (Special | C5.0 mm | ||
Conductors and | 0.3~0.5 mm |
| ||
Surface Treatment | Soft or Hard Ni/Au Sn/Pb Primary FluxCarbon 4~10µm Silver Gel |
| ||
Terminals and land | ||||
Insulation | 1000MW | IPC-TM-650 | ||
at Ambient | ||||
Dielectric | 5KV | IPC-TM-650 | ||
Surface Resistance | 5×012 | 2×015 | IPC-TM-650 | |
Volume Resistivity | 1×015 | 1×015 | IPC-TM-650 | |
Dielectric Constant (1 | 4 | 3.4 | IPC-TM-650 | |
Dissipation Factor (1 | 0.04 | 0.02 | IPC-TM-650 | |
Peeling Strength (180 | 1.2kgf/cm | 1.2kgf/cm | IPC-TM-650 | |
Solder Heat | 260 .C/10secs | 210 .C/3secs | ||
Flammability | 94 V-0 | 94VTM-0 | UL94 | |
Water Absorption | 2.90% | 1.00% | ASTM D570% | |
(24 Hours) | ||||
All Fields are Mandatory (*)
