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14 Layer Rigid-Flex PCB with 4 Layer Flex PCB

 

This is similar to the 12 Rigid-flex PCB with 2 layer flex PCB. The difference is that this design would be more complex due to the addition of 4 rigid-flex layers. The 4 layer flex circuit boards comprises conductive layers with an insulating layer in between. Connections are created between the layers by the use of plated through holes. The design of the 4 layer flex PCB allows for a great amount of flexibility in manufacturing. Access holes as well as exposed pads can be used on either side of the flex. Vias can be covered on both sides. We can even provide other components such as pins, components, connectors, and stiffeners. These features make the 14 layer rigid flex PCB extremely suitable for dynamic applications.

14 Layer Rigid-Flex
SpecificationsTechnology
Board Materials
FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Polyimide
Teflon
Black FR4
Arlon AR350
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
Metal Core Materials
Stiffeners
Thermo Set and PSA Based Aluminum
FR4
Stainless Steel
Polymide
Final PCB Thickness
2 Layer – Min .005″ Max .250″
4 Layer – Min .015″ Max .250″
6 Layer – Min .025″ Max .250″
8 Layer – Min .031″ Max .250″
10 Layer – Min .040″ Max .250″
12 Layer – Min .047” Max .250”
14 Layer – Min .054″ Max .250″
16 Layer – Min .062″ Max .250″
18 Layer – Min .093″ Max .250″
20 Layer – Min .125″ Max .250″
22 Layer – Min .125″ Max .250″
>24 Layer – Min .125″ Max .250″
Core Thickness
Min .0025″
Maximum PCB Size
2 Layer 20″ x 28″
Mulitlayer 16″ x 26″
Minimum Conductor Space0.003″
Minimum Conductor Width0.003″
Minimum Drill Hole Size0.006″
Finish Plating / Surface Finishes
HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
ENIG
Finished Copper – Outer Layers
1oz Cu – Min .004″ Trace/Space
2oz Cu – Min .005″ Trace Space
3oz Cu – Min .008″ Trace/Space
4oz Cu – Min .010″ Trace/Space
5oz Cu – Min .012″ Trace/Space
Finished Copper – Inner Layers
.5oz Cu – Min .004″ Trace/Space
1oz Cu – Min .005″ Trace/Space
2oz Cu – Min .006″ Trace/Space
3oz Cu – Min .010″ Trace/Space
4oz Cu – Min .012″ Trace/Space
Inner Layer Clearances
Min .008″
Minimum Finished Hole Size
Final Thickness 062″ – .006” Hole Final Thickness .150″ – .014″ Hole
Final Thickness .093″ – .010″ Hole Final Thickness .200″ – .018″ Hole
Final Thickness .125″ – .012″ Hole Final Thickness .250″ – .020″ Hole
Gold Fingers
Per IPC-SM-840
LPI Soldermask
Peelable Soldermask
Solder Mask Colors
Green/Green
Matte White
Black/Black
Matte Clear
Blue Top and Bottom Mix
Red One or Both Sides Mix
Silkscreen Type
Thermal Cure Epoxy Ink
LPI Ink
Silkscreen Colors
White
Black
Yellow Top and Bottom Mix
Red One or Both Sides Mix
Blue
CNC Functions
Scoring Edge to Edge Plated Counter bores
Skip Scoring – .250″ Spacing Milling
30 or 60 Degree Score Angle Blind and Buried Vias
30 to 100 Degree Countersink Controlled Z Axis Route
15 to 45 Degree Gold Finger Bevel Castellated Barrels
Counterbores Offset or Recessed Beveling
Plated Countersinks
Other PCB Services
Blind and Buried Vias
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Solder mask Plugged Vias Via Caps (Solder Mask)
Conductive Filled Vias
Quality / Testing
Inspect to IPC Class III Continuity Resistance – 10 to 20 Ohms
Net List Test per IPC-356D Isolation Resistance – 2 to 30 Megaohms
Test Voltage – 100 to 250 Volts Minimum SMT Pitch 0.5 mm
Tolerances
PTH Hole Size – +/- .002″
Front to Back – +/- .002″
NPTH Hole Size – +/- .001″
Solder Mask – +/- .002″
Tooling Holes – +/- .001″
Hole to Pad – +/- .005″

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