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16 Layer Rigid-Flex PCB with 12 Layer Flex PCB Book Binding

Circuit bookbinding is a best practice in the area of circuit design. The basic premise is that a small amount of length is added to the circuit, making it move in an outward direction from the bend radius. The use of this method allows the circuit to bend in only one direction. The amount of length added is based on the number of layers in the PCB and the tightness of the bend. The advantage of circuit bookbinding is that it removes a great amount of tension from the various circuit layers during the bending process. The method also helps to prevent buckling of the circuits at the exact bend radius.

16 Layer Rigid-Flex
SpecificationsTechnology
Board Materials
FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Polyimide
Teflon
Black FR4
Arlon AR350
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
Metal Core Materials
Stiffeners
Thermo Set and PSA Based Aluminum
FR4
Stainless Steel
Polymide
Final PCB Thickness
2 Layer – Min .005″ Max .250″
4 Layer – Min .015″ Max .250″
6 Layer – Min .025″ Max .250″
8 Layer – Min .031″ Max .250″
10 Layer – Min .040″ Max .250″
12 Layer – Min .047” Max .250”
14 Layer – Min .054″ Max .250″
16 Layer – Min .062″ Max .250″
18 Layer – Min .093″ Max .250″
20 Layer – Min .125″ Max .250″
22 Layer – Min .125″ Max .250″
>24 Layer – Min .125″ Max .250″
Core Thickness
Min .0025″
Maximum PCB Size
2 Layer 20″ x 28″
Mulitlayer 16″ x 26″
Minimum Conductor Space0.003″
Minimum Conductor Width0.003″
Minimum Drill Hole Size0.006″
Finish Plating / Surface Finishes
HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
ENIG
Finished Copper – Outer Layers
1oz Cu – Min .004″ Trace/Space
2oz Cu – Min .005″ Trace Space
3oz Cu – Min .008″ Trace/Space
4oz Cu – Min .010″ Trace/Space
5oz Cu – Min .012″ Trace/Space
Finished Copper – Inner Layers
.5oz Cu – Min .004″ Trace/Space
1oz Cu – Min .005″ Trace/Space
2oz Cu – Min .006″ Trace/Space
3oz Cu – Min .010″ Trace/Space
4oz Cu – Min .012″ Trace/Space
Inner Layer Clearances
Min .008″
Minimum Finished Hole Size
Final Thickness 062″ – .006” Hole Final Thickness .150″ – .014″ Hole
Final Thickness .093″ – .010″ Hole Final Thickness .200″ – .018″ Hole
Final Thickness .125″ – .012″ Hole Final Thickness .250″ – .020″ Hole
Gold Fingers
Per IPC-SM-840
LPI Soldermask
Peelable Soldermask
Solder Mask Colors
Green/Green
Matte White
Black/Black
Matte Clear
Blue Top and Bottom Mix
Red One or Both Sides Mix
Silkscreen Type
Thermal Cure Epoxy Ink
LPI Ink
Silkscreen Colors
White
Black
Yellow Top and Bottom Mix
Red One or Both Sides Mix
Blue
CNC Functions
Scoring Edge to Edge Plated Counter bores
Skip Scoring – .250″ Spacing Milling
30 or 60 Degree Score Angle Blind and Buried Vias
30 to 100 Degree Countersink Controlled Z Axis Route
15 to 45 Degree Gold Finger Bevel Castellated Barrels
Counterbores Offset or Recessed Beveling
Plated Countersinks
Other PCB Services
Blind and Buried Vias
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Solder mask Plugged Vias Via Caps (Solder Mask)
Conductive Filled Vias
Quality / Testing
Inspect to IPC Class III Continuity Resistance – 10 to 20 Ohms
Net List Test per IPC-356D Isolation Resistance – 2 to 30 Megaohms
Test Voltage – 100 to 250 Volts Minimum SMT Pitch 0.5 mm
Tolerances
PTH Hole Size – +/- .002″
Front to Back – +/- .002″
NPTH Hole Size – +/- .001″
Solder Mask – +/- .002″
Tooling Holes – +/- .001″
Hole to Pad – +/- .005″

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