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6 Layer Rigid-Flex PCB with 2 Layer Flex PCB with Unsupported Fingers

The term finger refers to the terminals that are located on card-edge connectors. These terminals are usually gold plated, which is why they are often referred to as ‘gold fingers’. These terminals can be designed in the PCB as supported or unsupported. At Rigiflex, we offer 6 layer rigid-flex PCBs with unsupported fingers with the two layer flex. The reason for performing gold plating is that the terminals become resistant to different types of acids. This allows the PCB to maintain a certain level of performance for long periods of time. Gold plating also increases the PCB’s overall strength and resistance in extremely harsh application environments.

6 Layer Rigid-Flex PCB with 2 Layer Flex PCB with Unsupported Fingers
Model:Rigid-flex board-6L
Layers:6
Material:FR4+Polyimide
Surface treatment:HARD GOLD+ENIG
Width/space:4/4mil
Finish thickness:0.3mm(flex),1.6mm
Min Hot:0.3mm
OEM Custom Service
Board Thickness:0.5mm~3.0mm (0.02″~0.12″)
Copper thickness:0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline: Routing, punching, V-Cut
Solder mask: White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size:18″*24″
Packing: Vacuum/Plastic bag
Layer: 1 – 20 layers

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

1~20(Rigid-Flex &
Multilayers FPC)

1~2

 

Single Sided

0.050 mm

 

Double Sided

0.075 mm

 

Drilling P.T.H.

0.2 mm

 

Punching

1.0 mm

 

Conductor Width
(W)

0.025 mm

W0.5mm

Hole Diameter (H)

0.05 mm
(withP.T.H.0.1mm)

H1.5mm

Accumulated Pitch
(P)

0.05 mm
(Special0.03mm)

P25mm

Outline Dimension
(L)

0.05 mm

L50 mm

Conductors and Outline
(C)

0.15 mm (Special
0.07mm)

C5.0 mm

Conductors and
Coverlay

0.3~0.5 mm

 

Surface Treatment
on

Soft or Hard Ni/Au Sn/Pb
(2~60µm)

Primary FluxCarbon
Printed

4~10µm Silver Gel
printed

 

Terminals and land
Areas

Insulation
Resistance

1000MW

IPC-TM-650
2.6.3.2

at Ambient

Dielectric
Strength

5KV

IPC-TM-650
2.5.6.1

Surface Resistance
(W)

5×012

2×015

IPC-TM-650
2.5.17

Volume Resistivity
(W-cm)

1×015

1×015

IPC-TM-650
2.5.17

Dielectric Constant (1
MHz)

4

3.4

IPC-TM-650
2.5.5.3

Dissipation Factor (1
MHz)

0.04

0.02

IPC-TM-650
2.5.5.3

Peeling Strength (180
irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650
2.4.9

Solder Heat
Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)

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