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6 Layer Rigid-Flex PCB with Break Away Panel Form

As one of leading flex PCB manufacturer, we own all the capabilities to support advanced designs with demanding requirements. Our range of 6 layer rigid-flex PCB with break away panel form is also the result of our exceptional technical knowledge and manufacturing experience. The team Rigiflex not only works on to provide the most innovative rigid flex circuit boards but also gives the assurance that the projects are completed faster, reducing time to market. Fully compliant with the IPC-6012, 6013, AS9100, ISO-9001, and UL94V.0 quality management systems, our rigid-flex printed circuit boards assure excellent performance in all conditions.

At Rigiflex, we get a variety of custom PCB design orders with extremely dense layers. In SMT line, additional board materials are required to facilitate the assembly process. To ensure complete and quality assembly, the breakaway panels are added to the PCB. This is performed to prevent any type of distortion of odd shaped PCBs. At Rigiflex, we use tab routing to create the breakaway panels. The panels also ensure that the corners of the PCB do not sag during processes such as reflow or wave soldering. Once attached to the PCB, the breakaway panels remain intact throughout the assembly process. They are removed only at the final stage before the PCB goes for testing and inspection.

With surface treatment with HARD GOLD+ENIG and surface finishing with immersion, Gold, HASL, and OSP, we augment the performance of 6 layer rigid-flex PCB with break away panel form for use in corrosion prone industrial environments. We, being a trusted rigid printed circuit board manufacturer, can customize these types of rigid flex printed circuit boards with board thickness 0.5mm~3.0mm (0.02″~0.12″) and copper thickness 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ. The boards are available in width/space 4/4mil and finish thickness 0.3 mm (flex), 1.6mm. Ask our expert to find out which solder mask color amongst White/Black/Blue/Green/Red, Taiyo PSR4000 white rightly suits your application.

6 Layer Rigid-Flex PCB with Break Away Panel Form
Model: Rigid-flex board-6L
Layers: 6
Material: FR4+Polyimide
Surface treatment: HARD GOLD+ENIG
Width/space: 4/4 mil
Finish thickness: 0.3mm(flex),1.6mm
Min Hot: 0.3mm

With the right match of services and experience, we at Rigiflex can handle your rigid flex PCB fabrication challenge optimally. We verify that the product is aligned with your requirements in every stage of the production to minimize any kind of rework at the later stage. Working in close association with customers, we ensure convenient and hassle-free business with us. Let us know your requirement in terms of building 6 layer rigid-flex PCB with break away panel form. We ensure that your orders are fulfilled in a quick turnaround in par with the quality expectations.

OEM Custom Service
Board Thickness :0.5mm~3.0mm (0.02″~0.12″)
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline: Routing, punching, V-Cut
Solder mask: White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size: 18″*24″
Packing: Vacuum/Plastic bag
Layer: 1 – 20 layers
SPECIFICATION
Materials Polyimide Polyester ( PET) Remark&
(Kapton) Test Method
1~20(Rigid-Flex &
Multilayers FPC)
1~2
Single Sided 0.050 mm
Double Sided 0.075 mm
Drilling P.T.H. 0.2 mm
Punching 1.0 mm
Conductor Width
(W)
0.025 mm W0.5mm
Hole Diameter (H) 0.05 mm
(withP.T.H.0.1mm)
H1.5mm
Accumulated Pitch
(P)
0.05 mm
(Special0.03mm)
P25mm
Outline Dimension
(L)
0.05 mm L50 mm
Conductors and Outline
(C)
0.15 mm (Special
0.07mm)
C5.0 mm
Conductors and
Coverlay
0.3~0.5 mm
Surface Treatment
on
Soft or Hard Ni/Au Sn/Pb
(2~60µm)

Primary FluxCarbon
Printed

4~10µm Silver Gel
printed

Terminals and land
Areas
Insulation
Resistance
1000MW IPC-TM-650
2.6.3.2
at Ambient
Dielectric
Strength
5KV IPC-TM-650
2.5.6.1
Surface Resistance
(W)
5×012 2×015 IPC-TM-650
2.5.17
Volume Resistivity
(W-cm)
1×015 1×015 IPC-TM-650
2.5.17
Dielectric Constant (1
MHz)
4 3.4 IPC-TM-650
2.5.5.3
Dissipation Factor (1
MHz)
0.04 0.02 IPC-TM-650
2.5.5.3
Peeling Strength (180
irection)
1.2kgf/cm 1.2kgf/cm IPC-TM-650
2.4.9
Solder Heat
Resistance
260 .C/10secs 210 .C/3secs
Flammability 94 V-0 94VTM-0 UL94
Water Absorption 2.90% 1.00% ASTM D570%
(24 Hours)

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