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High-resolution X-ray Inspection Services for Single, Double and Multi-sided PCB assemblies

X-ray inspection is performed on raw PCBs and advanced PCBs such as micro BGAS, BGAs, and QFN components, post re-flow. At Rigiflex, we employ X-ray inspection to detect various soldering, component, and BGA and CSP defects. Typically, we conduct X-ray inspection along with functional testing for best results. X-ray inspection is usually conducted during the big volume production of complex boards, and prototypes. Our grip on this technique allows us to provide defect-free printed circuit boards to clients.

X-ray Inspection Approach at Rigiflex

X-ray inspection is a non-interfering technique that gives a detailed information about the structural constitution of the PCB. At Rigiflex, our X-ray system produces high-resolution digital images, which help us detect defects as small as 0.001 inches. During the inspection, the equipment is rotated to examine a sample in various angles.

We provide X-ray inspection of turnkey printed circuit board assemblies (PCBA) and related components. At Rigiflex, we have set up size limitations up to 18″ x 18″, and weight is restricted to 5 pounds. Many times, image processing is performed for improving detail and contrast.

X- Ray Inspection Techniques

We employ the following inspection techniques at Rigiflex:

  • 2D Transmission X-ray: In this technique, x-rays are generated at a single point, and are allowed to pass through the PCBA. An image is produced at electronic detector. The image is then converted into the digital format, and transferred to a computer, where the analysis is being performed. This technique is employed for single sided printed circuit boards and assemblies that demand high reliability. Also, we use the latest image processing software which helps us automate inspection, distinguish components, and find soldering effects easily.
  • 3D X-ray: This X-ray technology is employed for complex double sided PCBs. Detector and x-ray source are the two requisites for 3-D X-ray inspection. The detector usually moves in 180 degree circular pattern. It focuses on features in one plane at a time, and other features are such as soldering joints, and components are blurred. Also, this technique allows us to focus on specific components, or areas of interest, without affecting the inspection time.

Applications of X-ray Inspection

At Rigiflex, we ensure the PCBs are free from the following:

  • Soldering Defects: We employ X-inspection to detect several soldering issues such as open circuits, solder shorts, solder bridges, insufficient soldering, solder voids, soldering quality, excess solder, etc.
  • Component Defects: We successfully verified various component defects arising due to lifted leads, missing components, faulty components, and misplaced components.
  • BGA and CSP Defects: BGA and CSP components have complex designs, which are not easily visible. Our advanced X-ray inspection technologies allow us to detect BGA shorts, soldering bumps, and open circuit connections.

At Rigiflex, we are always very particular about the quality of services and products offered to clients. This is why we have always taken care to upgrade our X-ray inspection and other testing equipment to their latest versions. This enables us to ship defect-free PCBs to our clients. Our vast industry experience, coupled with our knowledge of various functional testing methodologies has helped us build a base of happy and satisfied clients. For more information on our functional testing capabilities, please contact us at the earliest.

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