Designing Micro-vias with Sintered Paste for Rigid-Flex Printed Circuit Boards
Micro-vias are small, laser-drilled holes in printed circuit boards (PCBs) that connect different layers, ensuring seamless electrical conductivity in high-density interconnect (HDI) designs. Widely used in advanced electronics, such as smartphones, wearables, and automotive systems, micro-vias enable compact designs while maintaining optimal performance. Hence, it is imperative to create and strengthen these interlayer connections. Sintered