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10 Layer Rigid-Flex PCB with 4 Layer Flex Circuit Boards

As the name suggests, this 10 layer rigid-flex PCB has 4 additional flexible layers. This provides added advantages in terms of stability and flexibility. At Rigiflex, we use Polyimide, Kapton, and PET as the main fabrication materials. Standard as well specialized Taiyo PSR 4000 white solder masks are used for the rigid section. The main components of the PCB are mounted on the stable, rigid area of the PCB. The supplementary flexible layers allows for a large flex surface as well as high frequency component to connector connections across the flexible area. Overall, this results in dynamic bending, strong signal integrity, and high reliability.

10 Layer Rigid-Flex PCB with 4 Layer Flex Circuit Boards
Model:Rigid Flex PCB
Material:FR4+PI
Surface treatment:immersion gold
Width/space:4/4mil
Finish thickness:0.2mm(flex), 1.6mm
Min Hot:0.1mm
OEM Custom Service
Board Thickness0.5mm~3.0mm (0.02″~0.12″)
Copper thickness:0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline:Routing, punching, V-Cut
Solder mask:White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color:Black/White
Surface finishing:Immersion Gold, HASL, OSP
Max Panel size:18″*24″
Packing:Vacuum/Plastic bag
Layer:1 – 20 layers

 

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

1~20(Rigid-Flex & Multilayers FPC)

1~2

 

Single Sided

0.050 mm

 

Double Sided

0.075 mm

 

Drilling P.T.H.

0.2 mm

 

Punching

1.0 mm

 

Conductor Width (W)

0.025 mm

W0.5mm

Hole Diameter (H)

0.05 mm (withP.T.H.0.1mm)

H1.5mm

Accumulated Pitch (P)

0.05 mm (Special0.03mm)

P25mm

Outline Dimension (L)

0.05 mm

L50 mm

Conductors and Outline (C)

0.15 mm (Special 0.07mm)

C5.0 mm

Conductors and Coverlay

0.3~0.5 mm

 

Surface Treatment on

Soft or Hard Ni/Au Sn/Pb (2~60µm)

Primary FluxCarbon Printed

4~10µm Silver Gel printed

 

Terminals and land Areas

Insulation Resistance

1000MW

IPC-TM-650 2.6.3.2

at Ambient

Dielectric Strength

5KV

IPC-TM-650 2.5.6.1

Surface Resistance (W)

5×012

2×015

IPC-TM-650 2.5.17

Volume Resistivity (W-cm)

1×015

1×015

IPC-TM-650 2.5.17

Dielectric Constant (1 MHz)

4

3.4

IPC-TM-650 2.5.5.3

Dissipation Factor (1 MHz)

0.04

0.02

IPC-TM-650 2.5.5.3

Peeling Strength (180 irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650 2.4.9

Solder Heat Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)

 

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