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10 Layer Rigid-Flex PCB with 4 Layer Flex Circuit Boards

This is a specially designed 10 layer rigid-flex printed circuit board (PCB), which has 4 additional flexible layers. This provides advantages in terms of stability and flexibility. At Rigiflex, we use Polyimide, Kapton, and PET as the main materials for manufacturing printed circuit boards. Especially for the rigid section, we use specialized Taiyo PSR 4000 white solder masks. This stable, rigid area of the PCB is where the main components are mounted. The supplementary flexible layers allow for a large flex surface, as well as high frequency component to connector connections across the flexible area. Overall, this results in dynamic bending, strong signal integrity, and high reliability.

The 10 layer rigid-flex PCB with 4 layer flex circuit boards that we provide are made from FR4 + Pl material. The finish thickness of these printed circuit boards is 1.6 mm. These specially designed PCBs have a decent insulation resistance of about 1000 MW, and an excellent dielectric strength of 5 KV. These circuit boards are surface treated with immersion gold material. However, you can also get the surface finishing done in other materials, such as OSP, and HASL. You can avail these printed circuit boards in a wide range of copper thicknesses, including 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ. The board thickness can also be customized from 0.5 mm to 3.0 mm. The selection of solder mask can be done from varied color options, such as white, black, blue, green, red, and Taiyo PSR4000 white.

10 Layer Rigid-Flex PCB with 4 Layer Flex Circuit Boards
Model:Rigid Flex PCB
Material:FR4+PI
Surface treatment:immersion gold
Width/space:4/4mil
Finish thickness:0.2mm(flex), 1.6mm
Min Hot:0.1mm
OEM Custom Service
Board Thickness0.5mm~3.0mm (0.02″~0.12″)
Copper thickness:0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline:Routing, punching, V-Cut
Solder mask:White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color:Black/White
Surface finishing:Immersion Gold, HASL, OSP
Max Panel size:18″*24″
Packing:Vacuum/Plastic bag
Layer:1 – 20 layers

 

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

1~20(Rigid-Flex & Multilayers FPC)

1~2

 

Single Sided

0.050 mm

 

Double Sided

0.075 mm

 

Drilling P.T.H.

0.2 mm

 

Punching

1.0 mm

 

Conductor Width (W)

0.025 mm

W0.5mm

Hole Diameter (H)

0.05 mm (withP.T.H.0.1mm)

H1.5mm

Accumulated Pitch (P)

0.05 mm (Special0.03mm)

P25mm

Outline Dimension (L)

0.05 mm

L50 mm

Conductors and Outline (C)

0.15 mm (Special 0.07mm)

C5.0 mm

Conductors and Coverlay

0.3~0.5 mm

 

Surface Treatment on

Soft or Hard Ni/Au Sn/Pb (2~60µm)

Primary FluxCarbon Printed

4~10µm Silver Gel printed

 

Terminals and land Areas

Insulation Resistance

1000MW

IPC-TM-650 2.6.3.2

at Ambient

Dielectric Strength

5KV

IPC-TM-650 2.5.6.1

Surface Resistance (W)

5×012

2×015

IPC-TM-650 2.5.17

Volume Resistivity (W-cm)

1×015

1×015

IPC-TM-650 2.5.17

Dielectric Constant (1 MHz)

4

3.4

IPC-TM-650 2.5.5.3

Dissipation Factor (1 MHz)

0.04

0.02

IPC-TM-650 2.5.5.3

Peeling Strength (180 irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650 2.4.9

Solder Heat Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)

 

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