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4 Layer Rigid-Flex PCB

The basic layers for rigid-flex printed circuit boards provided by us are the four layer circuit boards. The flexible material is usually a single layer, but can be increased to suit an application. This type of rigid-flex PCB is designed to create a dynamic interaction between the circuit board and the electronic product in which it is used. Preferred material choices include Pyralux AP, Teflon-Kapton, and FR408. Use of laser technology allows for the creation of trace patterns as small as .003?. These PCBs are generally provided with ENIG finishes. Our flexible LPI solder mask colors include black, amber, white, and green. Applications include medical devices, consumer electronics, computer application, LED lighting, GPS, etc.

4 Layer Rigid-Flex PCB by Rigiflex Technology
Model:Rigid-flex board-4L
Layers:4
Material:FR4+Polyimide
Surface treatment:immersion gold
Width/space:8/8mil
Finish thickness:0.2mm(flex),1.0mm
Min Hot:0.8mm
OEM Custom Service
Board Thickness:0.5mm~3.0mm (0.02″~0.12″)
Copper thickness:0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline: Routing, punching, V-Cut
Solder mask: White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size:18″*24″
Packing: Vacuum/Plastic bag
Layer: 1 – 20 layers

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

1~20(Rigid-Flex &
Multilayers FPC)

1~2

 

Single Sided

0.050 mm

 

Double Sided

0.075 mm

 

Drilling P.T.H.

0.2 mm

 

Punching

1.0 mm

 

Conductor Width
(W)

0.025 mm

W0.5mm

Hole Diameter (H)

0.05 mm
(withP.T.H.0.1mm)

H1.5mm

Accumulated Pitch
(P)

0.05 mm
(Special0.03mm)

P25mm

Outline Dimension
(L)

0.05 mm

L50 mm

Conductors and Outline
(C)

0.15 mm (Special
0.07mm)

C5.0 mm

Conductors and
Coverlay

0.3~0.5 mm

 

Surface Treatment
on

Soft or Hard Ni/Au Sn/Pb
(2~60µm)

Primary FluxCarbon
Printed

4~10µm Silver Gel
printed

 

Terminals and land
Areas

Insulation
Resistance

1000MW

IPC-TM-650
2.6.3.2

at Ambient

Dielectric
Strength

5KV

IPC-TM-650
2.5.6.1

Surface Resistance
(W)

5×012

2×015

IPC-TM-650
2.5.17

Volume Resistivity
(W-cm)

1×015

1×015

IPC-TM-650
2.5.17

Dielectric Constant (1
MHz)

4

3.4

IPC-TM-650
2.5.5.3

Dissipation Factor (1
MHz)

0.04

0.02

IPC-TM-650
2.5.5.3

Peeling Strength (180
irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650
2.4.9

Solder Heat
Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)

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