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4 Layer Rigid-Flex PCB with ENIG Finish

Another surface finish offered by us to our customers is ENIG finish. ENIG stands for Electroless Nickel Immersion Gold, where a thin amount of gold is applied onto the nickel. The gold and nickel acts as second and third layers over the copper board. The nickel is designed to prevent the gold and the copper from interacting with each other. However, most of the gold tends to get absorbed during the nickel soldering process. Gold is utilized in this finish as it a good conductor of electricity. It, along with the nickel, helps to create a flat surface on the board. This finish is perhaps the best choice for applications that use surface mount devices and ball grid arrays.

4 Layer Rigid-Flex PCB with ENIG Finish
Model:Rigid-flex board-4L
Layers:4
Material:FR4+Polyimide
Surface treatment:immersion gold
Width/space:8/8mil
Finish thickness:0.2mm(flex),1.0mm
Min Hot:0.8mm
OEM Custom Service
Board Thickness0.5mm~3.0mm (0.02″~0.12″)
Copper thickness:0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline:Routing, punching, V-Cut
Solder mask:White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color:Black/White
Surface finishing:Immersion Gold, HASL, OSP
Max Panel size:18″*24″
Packing:Vacuum/Plastic bag
Layer:1 – 20 layers

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

1~20(Rigid-Flex & Multilayers FPC)

1~2

 

Single Sided

0.050 mm

 

Double Sided

0.075 mm

Drilling P.T.H.

0.2 mm

 

Punching

1.0 mm

 

Conductor Width (W)

0.025 mm

W0.5mm

Hole Diameter (H)

0.05 mm (withP.T.H.0.1mm)

H1.5mm

Accumulated Pitch (P)

0.05 mm (Special0.03mm)

P25mm

Outline Dimension (L)

0.05 mm

L50 mm

Conductors and Outline (C)

0.15 mm (Special 0.07mm)

C5.0 mm

Conductors and Coverlay

0.3~0.5 mm

 

Surface Treatment on

Soft or Hard Ni/Au Sn/Pb (2~60µm)

Primary FluxCarbon Printed

4~10µm Silver Gel printed

 

Terminals and land Areas

Insulation Resistance

1000MW

IPC-TM-650 2.6.3.2

at Ambient

Dielectric Strength

5KV

IPC-TM-650 2.5.6.1

Surface Resistance (W)

5×012

2×015

IPC-TM-650 2.5.17

Volume Resistivity (W-cm)

1×015

1×015

IPC-TM-650 2.5.17

Dielectric Constant (1 MHz)

4

3.4

IPC-TM-650 2.5.5.3

Dissipation Factor (1 MHz)

0.04

0.02

IPC-TM-650 2.5.5.3

Peeling Strength (180 irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650 2.4.9

Solder Heat Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)

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