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6 Layer Rigid-Flex PCB

Rigiflex’s 6 layered rigid-flex PCBs can be standard or custom made to suit the needs of the application. The PCBs are fabricated using array layouts, and can be made in a variety of sizes. More preference is given to the flexible layers for easier installation and usage. Custom designs can include more than 24 layers. The solder mask colors for these PCBs are flexible LPI S/M with colors of amber, white, green, and black. We also provide silk screen printing in black, yellow, white, and red colors. These PCBs are extremely useful in industrial applications such as industrial control, automobiles, power, lighting, and telecommunication.

6 Layer Rigid-Flex PCB
Model:Rigid-flex board-6L
Layers:6
Material:FR4+Polyimide
Surface treatment:HARD GOLD+ENIG
4/4mil
Finish thickness:0.3mm(flex),1.6mm
Min Hot:0.3mm
OEM Custom Service
Board Thickness0.5mm~3.0mm (0.02″~0.12″)
Copper thickness:0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline:Routing, punching, V-Cut
Solder mask:White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color:Black/White
Surface finishing:Immersion Gold, HASL, OSP
Max Panel size:18″*24″
Packing:Vacuum/Plastic bag
Layer:1 – 20 layers

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

1~20(Rigid-Flex & Multilayers FPC)

1~2

 

Single Sided

0.050 mm

 

Double Sided

0.075 mm

 

Drilling P.T.H.

0.2 mm

 

Punching

1.0 mm

 

Conductor Width (W)

0.025 mm

W0.5mm

Hole Diameter (H)

0.05 mm (withP.T.H.0.1mm)

H1.5mm

Accumulated Pitch (P)

0.05 mm (Special0.03mm)

P25mm

Outline Dimension (L)

0.05 mm

L50 mm

Conductors and Outline (C)

0.15 mm (Special 0.07mm)

C5.0 mm

Conductors and Coverlay

0.3~0.5 mm

 

Surface Treatment on

Soft or Hard Ni/Au Sn/Pb (2~60µm)

Primary FluxCarbon Printed

4~10µm Silver Gel printed

 

Terminals and land Areas

Insulation Resistance

1000MW

IPC-TM-650 2.6.3.2

at Ambient

Dielectric Strength

5KV

IPC-TM-650 2.5.6.1

Surface Resistance (W)

5×012

2×015

IPC-TM-650 2.5.17

Volume Resistivity (W-cm)

1×015

1×015

IPC-TM-650 2.5.17

Dielectric Constant (1 MHz)

4

3.4

IPC-TM-650 2.5.5.3

Dissipation Factor (1 MHz)

0.04

0.02

IPC-TM-650 2.5.5.3

Peeling Strength (180 irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650 2.4.9

Solder Heat Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)

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