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6 Layer Rigid-Flex PCB with 3 mil line/3 mil space with kapton stiffener

We at Rigiflex have the capabilities to design and manufacture rigid-flex PCBs with heavy copper and exotic materials. We can also configure the PCB with precise copper mil lines and mil spaces. Polyimide and Kapton are our two materials of choice for constructing the circuit board. To enhance the strength of the board, we also utilize a variety of Kapton stiffeners. The use of Kapton for the stiffeners provides a number of advantages when building the PCB. As a material, Kapton provides immense stability even in the most extreme ranges of temperature. It is flame retardant, as well as chemical and radiation resistant, thus reducing rework and replacement expenditure. It does not require cleaning or maintenance, which helps to maintain productivity.

6 Layer Rigid-Flex PCB with 3 mil line/3 mil space with kapton stiffener
Model:Rigid-flex board-6L
Layers:6
Material:FR4+Polyimide
Surface treatment:HARD GOLD+ENIG
Width/space:4/4mil
Finish thickness:0.3mm(flex),1.6mm
Min Hot:0.3mm
OEM Custom Service
Board Thickness:0.5mm~3.0mm (0.02″~0.12″)
Copper thickness:0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline: Routing, punching, V-Cut
Solder mask: White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size:18″*24″
Packing: Vacuum/Plastic bag
Layer: 1 – 20 layers

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

1~20(Rigid-Flex &
Multilayers FPC)

1~2

 

Single Sided

0.050 mm

 

Double Sided

0.075 mm

 

Drilling P.T.H.

0.2 mm

 

Punching

1.0 mm

 

Conductor Width
(W)

0.025 mm

W0.5mm

Hole Diameter (H)

0.05 mm
(withP.T.H.0.1mm)

H1.5mm

Accumulated Pitch
(P)

0.05 mm
(Special0.03mm)

P25mm

Outline Dimension
(L)

0.05 mm

L50 mm

Conductors and Outline
(C)

0.15 mm (Special
0.07mm)

C5.0 mm

Conductors and
Coverlay

0.3~0.5 mm

 

Surface Treatment
on

Soft or Hard Ni/Au Sn/Pb
(2~60µm)

Primary FluxCarbon
Printed

4~10µm Silver Gel
printed

 

Terminals and land
Areas

Insulation
Resistance

1000MW

IPC-TM-650
2.6.3.2

at Ambient

Dielectric
Strength

5KV

IPC-TM-650
2.5.6.1

Surface Resistance
(W)

5×012

2×015

IPC-TM-650
2.5.17

Volume Resistivity
(W-cm)

1×015

1×015

IPC-TM-650
2.5.17

Dielectric Constant (1
MHz)

4

3.4

IPC-TM-650
2.5.5.3

Dissipation Factor (1
MHz)

0.04

0.02

IPC-TM-650
2.5.5.3

Peeling Strength (180
irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650
2.4.9

Solder Heat
Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)

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