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6 Layer Rigid-Flex PCB with Selective Gold and Solder Plating

PCBs are designed in accordance with their performance in an application. Many times, the PCBs are used in aggressive environments such as automotive, aerospace, and military. Such environments comprise high amounts of chemical precipitation. To avoid this problem, we at Rigiflex provide rigid-flex PCBs with gold and solder plating. We provide hard gold as well as ENIG for the surface finishes. Selective solder plating acts as an effective etch resist when used with acidic etchants. Gold and solder plating add to the overall strength and resistance of the PCB in harsh application environments. They also ensure that the PCB will have a long service life.

6 Layer Rigid-Flex PCB with Selective Gold and Solder Plating
Model:Rigid-flex board-6L
Layers:6
Material:FR4+Polyimide
Surface treatment:HARD GOLD+ENIG
Width/space:4/4mil
Finish thickness:0.3mm(flex),1.6mm
Min Hot:0.3mm
OEM Custom Service
Board Thickness:0.5mm~3.0mm (0.02″~0.12″)
Copper thickness:0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline: Routing, punching, V-Cut
Solder mask: White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size:18″*24″
Packing: Vacuum/Plastic bag
Layer: 1 – 20 layers

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

1~20(Rigid-Flex &
Multilayers FPC)

1~2

 

Single Sided

0.050 mm

 

Double Sided

0.075 mm

 

Drilling P.T.H.

0.2 mm

 

Punching

1.0 mm

 

Conductor Width
(W)

0.025 mm

W0.5mm

Hole Diameter (H)

0.05 mm
(withP.T.H.0.1mm)

H1.5mm

Accumulated Pitch
(P)

0.05 mm
(Special0.03mm)

P25mm

Outline Dimension
(L)

0.05 mm

L50 mm

Conductors and Outline
(C)

0.15 mm (Special
0.07mm)

C5.0 mm

Conductors and
Coverlay

0.3~0.5 mm

 

Surface Treatment
on

Soft or Hard Ni/Au Sn/Pb
(2~60µm)

Primary FluxCarbon
Printed

4~10µm Silver Gel
printed

 

Terminals and land
Areas

Insulation
Resistance

1000MW

IPC-TM-650
2.6.3.2

at Ambient

Dielectric
Strength

5KV

IPC-TM-650
2.5.6.1

Surface Resistance
(W)

5×012

2×015

IPC-TM-650
2.5.17

Volume Resistivity
(W-cm)

1×015

1×015

IPC-TM-650
2.5.17

Dielectric Constant (1
MHz)

4

3.4

IPC-TM-650
2.5.5.3

Dissipation Factor (1
MHz)

0.04

0.02

IPC-TM-650
2.5.5.3

Peeling Strength (180
irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650
2.4.9

Solder Heat
Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)

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