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12 Layer Rigid Polyimide PCB with Heat Sink

 

This 12 layer rigid PCB is designed to be used in high stress and temperature applications. Polyimide is used as one of the main materials as it is an organic material that provides immense heat resistance. Gold is used as the surface finish material because it helps the PCB remain stable even in harsh application environments. We have added heat sink so the PCB can dissipate heat easily in high temperature applications. This PCB has the capabilities to reach thermal stresses up to 288℃ & 20 Sec. Impedance control tolerance is at +/-10%. For custom PCB designs, we provide varied surface finish options such as carbon ink, lead free HASL, immersion tin and silver, and OSP.

12 Layer Rigid Polyimide PCB with Heat Sink
Model:12L PCB
Base Material:12L,FR4, TG170
Board Thickness:2.0 mm
Copper Thickness:1/H…H/1OZ
Min. Hole Size:3mil (0.076mm)
Min. Line Width/ Spacing:3/3mil
Solder mask/ Silkscreen Color:Green/White
Surface Finishing:Gold
Rigid PCB Capability
No.Item Technical data
1Layer Count1-30Layers
2HDI Type1+N+1, 2+N+2
3MaterialCEM3, FR-4, Halogen Free, Aluminum-based, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide etc
4Board thickness0.2~5.0mm
5Board SizeMax.18”x24”
Min.30x50mm
6Copper ThicknessOuter layer1oz~6oz
Inner layerHoz~5oz
7Min. Line Width/Space4/4mil(0.1/0.1mm)
8Finished Hole sizeMechanical0.20~6.30mm
Laser5mil, 6mil
9Blind/buried via(Mechanical)0.2mm (min)
10Aspect Ratio10:1
11Hole Dia.TolerancePTH±0.075mm(3mil)
NPTH±0.05mm (2mil)
12Hole Position Tolerance±0.05mm (2mil)
13Bow & Twist≤0.75%
14Peel strength1.4N/mm
15Thermal stress288℃ & 20 Sec
16Test Voltage50-300V
17Soldermask colorGreen, Red, Blue, Black, White
18Silkscreen colorWhite, Black, Yellow
19Min. S/M Pitch4mil(0.1mm)
20Min. Solder Mask Clearance0.05mm
21Impedance Control Tolerance+/-10%
22Outline Tolerance±0.10mm (4mil)
23Surface FinishHASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask

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