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14 Layer Rigid Flex Circuit Boards with Gold and Solder Plating

Rigiflex is one of the leading and experienced manufacturers of rigid-flex printed circuit boards (PCBs) in the US. We add gold plating to the PCBs, which helps strengthen the design and manufacture of the PCBs. Gold plating is most commonly done for edge connectors, as well as membrane switches. If you want to protect the components of your PCBs from wear and tear, and make them last for several years together, then electroplated gold at 300 micro inches is used. We also provide rigid PCBs with solder plating to enhance the imaging process. Solder plating is only applicable to those boards that are not coated with solder masks. Also, solder plating can be done on those boards, over which components are hand soldered and assembled. If proper maintenance is done, then this solder plating has the capability to last for a number of years.

The 14 layer rigid-flex circuit boards that we manufacture come with gold and solder plating. The surface finishing of these printed circuit boards is of gold. However, you can also select from other surface finish options, which include HASL, lead-free HASL, Immersion Gold/Tin/Silver, OSP, flash gold, gold fingers, plating hard gold, and peelable mask. We have the capability to provide you 14 layer rigid-flex circuit boards with a total board thickness of 2.0 mm. The base material used for these circuit boards is FR4 TG170, which is a glass fabric-based epoxy resin copper clad laminate. The minimum solder mask clearance that we provide is 0.05 mm.

14 Layer Rigid Flex Circuit Boards with Gold and Solder Plating
Model14L PCB
Base Material:14L,FR4, TG170
Board Thickness:2.0 mm
Copper Thickness:1/H…H/1OZ
Min. Hole Size:3mil (0.076mm)
Min. Line Width/ Spacing:3/3mil
Solder mask/ Silkscreen Color:Green/White
Surface Finishing:Gold
Rigid PCB Capability
No.ItemTechnical data
1Layer Count1-30Layers
2HDI Type1+N+1, 2+N+2
3MaterialCEM3, FR-4, Halogen Free, Aluminum-based, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide etc
4Board thickness0.2~5.0mm
5Board SizeMax.18”x24”
Min.30x50mm
6Copper ThicknessOuter layer1oz~6oz
Inner layerHoz~5oz
7Min. Line Width/Space4/4mil(0.1/0.1mm)
8Finished Hole sizeMechanical0.20~6.30mm
Laser5mil, 6mil
9Blind/buried via(Mechanical)0.2mm (min)
10Aspect Ratio10:1
11Hole Dia.TolerancePTH±0.075mm(3mil)
NPTH±0.05mm (2mil)
12Hole Position Tolerance±0.05mm (2mil)
13Bow & Twist≤0.75%
14Peel strength1.4N/mm
15Thermal stress288℃ & 20 Sec
16Test Voltage50-300V
17Soldermask colorGreen, Red, Blue, Black, White
18Silkscreen colorWhite, Black, Yellow
19Min. S/M Pitch4mil(0.1mm)
20Min. Solder Mask Clearance0.05mm
21Impedance Control Tolerance+/-10%
22Outline Tolerance±0.10mm (4mil)
23Surface FinishHASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask

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