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6 Layer Rigid PCB Polyimide with Step down Finger on Layer 3

At Rigiflex, we have been manufacturing various types of rigid-flex printed circuit boards (PCBs) for several years now. This has given us an understanding of the exact requirements of our customers. Along with the several rigid-flex PCBs, we have the capability to provide the 6 layer rigid polyimide PCB with step down finger on layer 3. The step down fingers are basically used as connectors, and are lined up along the edge of the substrate. These step down fingers are also referred to as contact fingers. The primary function of these contact fingers is to connect a PCB to another PCB or other electronic devices.

The 6 layer rigid PCB that we provide is made from the polyimide material, owing to its favorable and beneficial properties. The material has a great thermal stability, excellent chemical resistance, amazingly heat resistant, and good mechanical properties. The total board thickness of the circuit board is 1.6 mm. The copper thickness of this printed circuit board is 1 OZ. We have the capability to provide a minimum hole size of 4 mil (0.1 mm) for these PCBs. We use gold as the primary surface finish for the manufactured circuit board. At Rigiflex, the surface finishes for step down fingers is performed using different raw materials, such as lead-free HASL, immersion tin, or gold. These rigid printed circuit boards can be mounted as Plated-through Holes (PTH) or Non Plated-through Holes (NPTH). If you choose to go with the PTH, then the hole diameter is ±0.075mm. On the other hand, for the NPTH option, the diameter of the hole is ±0.05mm. The soldermask color can be selected by the customer from a variety of color options, which include white, blue, black, red, or green.

6 Layer Rigid PCB Polyimide with Step down Finger on Layer 3
Model:6L PCB
Base Material:6L, FR4,TG135
Board Thickness:1.6 mm
Copper Thickness:1OZ
Min. Hole Size:4mil (0.1mm)
Min. Width/Gap:4/5mil
Surface Finishing:Gold
Rigid PCB Capability
No.ItemTechnical data
1Layer Count1-30Layers
2HDI Type1+N+1, 2+N+2
3MaterialCEM3, FR-4, Halogen Free, Aluminum-based, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide etc
4Board thickness0.2~5.0mm
5Board SizeMax.18”x24”
6Copper ThicknessOuter layer1oz~6oz
Inner layerHoz~5oz
7Min. Line Width/Space4/4mil(0.1/0.1mm)
8Finished Hole sizeMechanical0.20~6.30mm
Laser5mil, 6mil
9Blind/buried via(Mechanical)0.2mm (min)
10Aspect Ratio10:1
11Hole Dia.TolerancePTH±0.075mm(3mil)
NPTH±0.05mm (2mil)
12Hole Position Tolerance±0.05mm (2mil)
13Bow & Twist≤0.75%
14Peel strength1.4N/mm
15Thermal stress288℃ & 20 Sec
16Test Voltage50-300V
17Soldermask colorGreen, Red, Blue, Black, White
18Silkscreen colorWhite, Black, Yellow
19Min. S/M Pitch4mil(0.1mm)
20Min. Solder Mask Clearance0.05mm
21Impedance Control Tolerance+/-10%
22Outline Tolerance±0.10mm (4mil)
23Surface FinishHASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask

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