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8 Layer Rigid Polyimide PCB

 

Rigid polyimide printed circuit boards (PCBs) are being used today in a wide range of applications. The reason for the popularity of these types of PCBs include their immunity to movement, low electronic noise, compact size, and ease in diagnostics and repair. These circuit boards can be designed and manufactured in varying layer options. There are many manufacturers in the US, who can help you design and manufacture rigid PCBs in polyimide material. Out of the many manufacturers, Rigiflex is one experienced one. It can help you design 8 layer rigid polyimide PCBs. These circuit boards are specially designed to suit high temperature applications.

There are several beneficial features of the polyimide material, and that is why it is used in these rigid PCBs. Some striking benefits of this material include high chemical resistance, exceptional mechanical properties, and excellent thermal stability. In addition to this, the material is known for its amazing flexibility, and high tensile strength.

We have the capability to design 8 layer rigid PCBs in FR4, and TG170 as the base material options, too. The board thickness that we can offer for these polyimide PCBs is 2.0 mm. The copper thickness of these printed circuit boards is 1/H…H/1OZ. We can provide you these circuit boards, with hole size of 3 mil, and minimum line/width spacing of 3/3mil. These printed circuit boards have a thermal stress up to 288 °C & 20 Sec.

At Rigiflex, we follow a customer first approach, and this allows us to design and manufacture in a wide range of capabilities, that suit the varying requirements of our clients. We have been into this business for quite many years now, and this has helps us gain the expertise required for producing 8 layer rigid polyimide PCBs that are of highest industry standards.

8 Layer Rigid Polyimide PCB
Model:8L PCB Board
Base Material:8L,FR4, TG170
Board Thickness:2.0 mm
Copper Thickness:1/H…H/1OZ
Min. Hole Size:3mil (0.076mm)
Min. Line Width/ Spacing:3/3mil
Solder mask/ Silkscreen Color:Green/White
Surface Finishing:Gold
Rigid PCB Capability
No.ItemTechnical data
1Layer Count1-30Layers
2HDI Type1+N+1, 2+N+2
3MaterialCEM3, FR-4, Halogen Free, Aluminum-based, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide etc
4Board thickness0.2~5.0mm
5Board SizeMax.18”x24”
Min.30x50mm
6Copper ThicknessOuter layer1oz~6oz
Inner layerHoz~5oz
7Min. Line Width/Space4/4mil(0.1/0.1mm)
8Finished Hole sizeMechanical0.20~6.30mm
Laser5mil, 6mil
9Blind/buried via(Mechanical)0.2mm (min)
10Aspect Ratio10:1
11Hole Dia.TolerancePTH±0.075mm(3mil)
NPTH±0.05mm (2mil)
12Hole Position Tolerance±0.05mm (2mil)
13Bow & Twist≤0.75%
14Peel strength1.4N/mm
15Thermal stress288℃ & 20 Sec
16Test Voltage50-300V
17Soldermask colorGreen, Red, Blue, Black, White
18Silkscreen colorWhite, Black, Yellow
19Min. S/M Pitch4mil(0.1mm)
20Min. Solder Mask Clearance0.05mm
21Impedance Control Tolerance+/-10%
22Outline Tolerance±0.10mm (4mil)
23Surface FinishHASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask

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