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8 Layer Rigid Polyimide PCB

 

The 8 layer rigid PCB with polyimide is another product offering designed for high temperature applications. Polyimide is chosen as the main material as it comprises good mechanical properties, high chemical resistance, and thermal stability. Polyimide is also known to have high tensile strength, which provides a significant advantage to a rigid PCB. We also use FR4 and TG170 as the base materials. The board thickness for this PCB is 2.0mm while the copper thickness is 1/H…H/1OZ. We have the capabilities to provide 3mil in terms of hole size and line and width spacing. Thermal stress is up to 288℃ & 20 Sec, while test voltage is between 50 and 300V.

8 Layer Rigid Polyimide PCB
Model:8L PCB Board
Base Material:8L,FR4, TG170
Board Thickness:2.0 mm
Copper Thickness:1/H…H/1OZ
Min. Hole Size:3mil (0.076mm)
Min. Line Width/ Spacing:3/3mil
Solder mask/ Silkscreen Color:Green/White
Surface Finishing:Gold
Rigid PCB Capability
No.ItemTechnical data
1Layer Count1-30Layers
2HDI Type1+N+1, 2+N+2
3MaterialCEM3, FR-4, Halogen Free, Aluminum-based, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide etc
4Board thickness0.2~5.0mm
5Board SizeMax.18”x24”
Min.30x50mm
6Copper ThicknessOuter layer1oz~6oz
Inner layerHoz~5oz
7Min. Line Width/Space4/4mil(0.1/0.1mm)
8Finished Hole sizeMechanical0.20~6.30mm
Laser5mil, 6mil
9Blind/buried via(Mechanical)0.2mm (min)
10Aspect Ratio10:1
11Hole Dia.TolerancePTH±0.075mm(3mil)
NPTH±0.05mm (2mil)
12Hole Position Tolerance±0.05mm (2mil)
13Bow & Twist≤0.75%
14Peel strength1.4N/mm
15Thermal stress288℃ & 20 Sec
16Test Voltage50-300V
17Soldermask colorGreen, Red, Blue, Black, White
18Silkscreen colorWhite, Black, Yellow
19Min. S/M Pitch4mil(0.1mm)
20Min. Solder Mask Clearance0.05mm
21Impedance Control Tolerance+/-10%
22Outline Tolerance±0.10mm (4mil)
23Surface FinishHASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask

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