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X-ray inspection is performed on raw PCBs and advanced PCBs such as micro BGAS, BGAs, and QFN components, post re-flow. At Rigiflex, we employ X-ray inspection to detect various soldering, component, and BGA and CSP defects. Typically, we conduct X-ray inspection along with functional testing for best results. X-ray inspection is usually conducted during the big volume production of complex boards, and prototypes. Our grip on this technique allows us to provide defect-free printed circuit boards to clients.
X-ray inspection is a non-interfering technique that gives a detailed information about the structural constitution of the PCB. At Rigiflex, our X-ray system produces high-resolution digital images, which help us detect defects as small as 0.001 inches. During the inspection, the equipment is rotated to examine a sample in various angles.
We provide X-ray inspection of turnkey printed circuit board assemblies (PCBA) and related components. At Rigiflex, we have set up size limitations up to 18″ x 18″, and weight is restricted to 5 pounds. Many times, image processing is performed for improving detail and contrast.
We employ the following inspection techniques at Rigiflex:
At Rigiflex, we are always very particular about the quality of services and products offered to clients. This is why we have always taken care to upgrade our X-ray inspection and other testing equipment to their latest versions. This enables us to ship defect-free PCBs to our clients. Our vast industry experience, coupled with our knowledge of various functional testing methodologies has helped us build a base of happy and satisfied clients. For more information on our functional testing capabilities, please contact us at the earliest.
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