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14 Layer Rigid-Flex PCB


Rigiflex is one of the leading manufacturers of 14 layer rigid-flex PCBs. These PCBs are used for applications, which demand extreme precision and tight tolerances. Over the years, we have helped clients by designing and providing compact sized 14 layer rigid-flex PCBs. These circuit boards comprise flexible inner layers, which are attached using a prepeg film, which resembles to a multilayer flexible circuit. These rigid-flex PCBs are equipped with a board internally, externally, or both – as needed by the circuit.

The rigid components of these circuit boards are utilized for high density device boards. Additionally, flexible circuits allow narrow lines, thereby supporting high density device population. The combination of rigid boards and flexible circuits allow us to offer streamline design, thereby reducing package weight and size.

Typically, these circuit boards are made from FR4 material. We can also provide them in exotic materials such as Rogers Ultralam 2000, Rogers RO4350, Arlon AR350, Nelco 4013, as well as several metal core materials. We use various types of stiffeners to bond flexible layers. They include stainless steel, FR4, polyimide, etc. We can provide 14 layer rigid-flex PCBs in minimum thickness 0.054ʺ and maximum thickness 0.250ʺ. The surface treatment is ENIG, whereas we also provide surface finishes like HASL – leaded and lead free solders, electroless soft gold, electrolytic nickel, immersion silver, carbon ink, etc. We use advanced laser machines, which enable us to deliver accuracy of mil traces, lines, and patterns. The 14 layer rigid-flex PCBs are used in applications such as telecommunication, computers, medical devices, and automobiles.

14 Layer Rigid-Flex
Specifications Technology
Board Materials
FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Black FR4
Arlon AR350
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
Metal Core Materials
Thermo Set and PSA Based Aluminum
Stainless Steel
Final PCB Thickness
2 Layer – Min .005″ Max .250″
4 Layer – Min .015″ Max .250″
6 Layer – Min .025″ Max .250″
8 Layer – Min .031″ Max .250″
10 Layer – Min .040″ Max .250″
12 Layer – Min .047” Max .250”
14 Layer – Min .054″ Max .250″
16 Layer – Min .062″ Max .250″
18 Layer – Min .093″ Max .250″
20 Layer – Min .125″ Max .250″
22 Layer – Min .125″ Max .250″
>24 Layer – Min .125″ Max .250″
Core Thickness
Min .0025″
Maximum PCB Size
2 Layer 20″ x 28″
Mulitlayer 16″ x 26″
Minimum Conductor Space 0.003″
Minimum Conductor Width 0.003″
Minimum Drill Hole Size 0.006″
Finish Plating / Surface Finishes
HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
Finished Copper – Outer Layers
1oz Cu – Min .004″ Trace/Space
2oz Cu – Min .005″ Trace Space
3oz Cu – Min .008″ Trace/Space
4oz Cu – Min .010″ Trace/Space
5oz Cu – Min .012″ Trace/Space
Finished Copper – Inner Layers
.5oz Cu – Min .004″ Trace/Space
1oz Cu – Min .005″ Trace/Space
2oz Cu – Min .006″ Trace/Space
3oz Cu – Min .010″ Trace/Space
4oz Cu – Min .012″ Trace/Space
Inner Layer Clearances
Min .008″
Minimum Finished Hole Size
Final Thickness 062″ – .006” Hole Final Thickness .150″ – .014″ Hole
Final Thickness .093″ – .010″ Hole Final Thickness .200″ – .018″ Hole
Final Thickness .125″ – .012″ Hole Final Thickness .250″ – .020″ Hole
Gold Fingers
Per IPC-SM-840
LPI Soldermask
Peelable Soldermask
Solder Mask Colors
Matte White
Matte Clear
Blue Top and Bottom Mix
Red One or Both Sides Mix
Silkscreen Type
Thermal Cure Epoxy Ink
Silkscreen Colors
Yellow Top and Bottom Mix
Red One or Both Sides Mix
CNC Functions
Scoring Edge to Edge Plated Counter bores
Skip Scoring – .250″ Spacing Milling
30 or 60 Degree Score Angle Blind and Buried Vias
30 to 100 Degree Countersink Controlled Z Axis Route
15 to 45 Degree Gold Finger Bevel Castellated Barrels
Counterbores Offset or Recessed Beveling
Plated Countersinks
Other PCB Services
Blind and Buried Vias
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Solder mask Plugged Vias Via Caps (Solder Mask)
Conductive Filled Vias
Quality / Testing
Inspect to IPC Class III Continuity Resistance – 10 to 20 Ohms
Net List Test per IPC-356D Isolation Resistance – 2 to 30 Megaohms
Test Voltage – 100 to 250 Volts Minimum SMT Pitch 0.5 mm
PTH Hole Size – +/- .002″
Front to Back – +/- .002″
NPTH Hole Size – +/- .001″
Solder Mask – +/- .002″
Tooling Holes – +/- .001″
Hole to Pad – +/- .005″

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