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14 Layer Rigid-Flex PCB with 3 Mil Line 3 Mil Space

 

At Rigiflex Technology, Inc. we have been committed to providing high precision rigid flex printed circuit boards to the market at a faster rate, whilst not compromising on the quality. With a full scale PCB manufacturing capabilities, we are proud to fulfilling thousands of orders successfully. We own a global team of engineers, designers, R&D personnel who enable us attain 100% customer satisfaction by providing high quality boards including 14 layer rigid-flex PCB with 3 Mil Line 3 Mil Space. Having seen major technological developments over the years, we incorporate the right design tactics to produce this time-critical, high performance 3 Mil Line 3 Mil Space PCBs with 14 layers.

Creating copper traces is one of the crucial steps in rigid flex PCBs manufacturing. This is majorly done to connect electrical signals. Here comes the relevance of fabricating rigid flex circuit boards including mil line and mil space. The purpose of mil line and mil space is to give enough space for the copper to expand or bloat without the lines touching each other. This construction using 3 Mil Line 3 Mil Space is rightly suites when it comes to manufacturing PCBs from heavy copper and other exotic materials. In other words, our range of 14 layer rigid-flex PCB with 3 Mil Line 3 Mil Space PCBs is best suited for high end applications that require power, speed and accuracy. Being a leading rigid printed circuit board manufacturer, Rigiflex work together as a team to provide the most accurate, timely, and cost-effective designs to the customers.

At Rigiflex, we work closely with our customers from the beginning to ensure that they get the right product in conformity with every specification. We can create 14 layer rigid-flex PCB with 3 Mil Line 3 Mil Space boards using materials such as FR4 (Tg – 135C, 145C, 170C), Rogers Ultralam 2000, Polyimide, Teflon, Black FR4, Arlon AR350, Getek Copper Clad Thermal Substrates, Hybrid (Rogers and FR4) BT Epoxy, and so on. Moreover, our capabilities lie in creating the board with tolerances such as PTH Hole Size – +/- .002″, Front to Back – +/- .002″, NPTH Hole Size – +/- .001″, Solder Mask – +/- .002″, Tooling Holes – +/- .001″ and Hole to Pad – +/- .005″.

We are proud to be working with this revolutionary technology of creating PCBs using with 3 Mil Line 3 Mil Space. Being a flexible printed circuit board manufacturer, you can count on the quality of the end product on every order. Whether you need a few quick turn PCB prototypes or mass production, we are all set to deliver the solutions that fit the go to market strategy.

14 Layer Rigid-Flex
Specifications Technology
Board Materials

FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Polyimide
Teflon
Black FR4
Arlon AR350
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
Metal Core Materials
Stiffeners

Thermo Set and PSA Based Aluminum
FR4
Stainless Steel
Polymide
Final PCB Thickness

2 Layer – Min .005″ Max .250″
4 Layer – Min .015″ Max .250″
6 Layer – Min .025″ Max .250″
8 Layer – Min .031″ Max .250″
10 Layer – Min .040″ Max .250″
12 Layer – Min .047” Max .250”
14 Layer – Min .054″ Max .250″
16 Layer – Min .062″ Max .250″
18 Layer – Min .093″ Max .250″
20 Layer – Min .125″ Max .250″
22 Layer – Min .125″ Max .250″
>24 Layer – Min .125″ Max .250″
Core Thickness

Min .0025″
Maximum PCB Size
2 Layer 20″ x 28″
Mulitlayer 16″ x 26″
Minimum Conductor Space 0.003″
Minimum Conductor Width 0.003″
Minimum Drill Hole Size 0.006″
Finish Plating / Surface Finishes
HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
ENIG
Finished Copper – Outer Layers
1oz Cu – Min .004″ Trace/Space
2oz Cu – Min .005″ Trace Space
3oz Cu – Min .008″ Trace/Space
4oz Cu – Min .010″ Trace/Space
5oz Cu – Min .012″ Trace/Space
Finished Copper – Inner Layers
.5oz Cu – Min .004″ Trace/Space
1oz Cu – Min .005″ Trace/Space
2oz Cu – Min .006″ Trace/Space
3oz Cu – Min .010″ Trace/Space
4oz Cu – Min .012″ Trace/Space
Inner Layer Clearances
Min .008″
Minimum Finished Hole Size
Final Thickness 062″ – .006” Hole Final Thickness .150″ – .014″ Hole
Final Thickness .093″ – .010″ Hole Final Thickness .200″ – .018″ Hole
Final Thickness .125″ – .012″ Hole Final Thickness .250″ – .020″ Hole
Gold Fingers
Per IPC-SM-840
LPI Soldermask
Peelable Soldermask
Solder Mask Colors
Green/Green
Matte White
Black/Black
Matte Clear
Blue Top and Bottom Mix
Red One or Both Sides Mix
Silkscreen Type
Thermal Cure Epoxy Ink
LPI Ink
Silkscreen Colors
White
Black
Yellow Top and Bottom Mix
Red One or Both Sides Mix
Blue
CNC Functions
Scoring Edge to Edge Plated Counter bores
Skip Scoring – .250″ Spacing Milling
30 or 60 Degree Score Angle Blind and Buried Vias
30 to 100 Degree Countersink Controlled Z Axis Route
15 to 45 Degree Gold Finger Bevel Castellated Barrels
Counterbores Offset or Recessed Beveling
Plated Countersinks
Other PCB Services
Blind and Buried Vias
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Solder mask Plugged Vias Via Caps (Solder Mask)
Conductive Filled Vias
Quality / Testing
Inspect to IPC Class III Continuity Resistance – 10 to 20 Ohms
Net List Test per IPC-356D Isolation Resistance – 2 to 30 Megaohms
Test Voltage – 100 to 250 Volts Minimum SMT Pitch 0.5 mm
Tolerances
PTH Hole Size – +/- .002″
Front to Back – +/- .002″
NPTH Hole Size – +/- .001″
Solder Mask – +/- .002″
Tooling Holes – +/- .001″
Hole to Pad – +/- .005″

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