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14 Layer Rigid-Flex PCB with 4 Layer Flex PCB


Rigiflex Technology, Inc. has been an industry leading flex PCB manufacturer who aims to bring the finest range of boards that are produced in par with the customers’ specifications. With hard-earned industrial experience, we build flexible printed circuit boards with dependable quality. Our range of 14 layer rigid-flex PCB with 4 layer flex PCBs is also manufactured to the highest quality standards to withstand the rigors of the aerospace, medical, automotive, military, and oil and gas applications. These flexible circuit boards are extremely suitable for dynamic applications.

As the name implies, these 14 layer rigid-flex PCB with 4 layer flex PCBs has additional l4 rigid-flex conductive layers with an insulating layer in between. Although these boards are similar to 12 rigid-flex PCB with 2 layer flex PCB in several aspects, the design is more complex than the 12 rigid-flex PCBs. We, at Rigiflex, utilize plated-through holes to create connections between the layers of the flex circuit board. Access holes and pads are used on either side of the flex and Vias are covered on both sides. We can also provide other components such as pins, components, connectors, and stiffeners as per the customers’ requirements. The design of the 4 layer flex PCB allows for a great amount of flexibility in manufacturing.

A few of the board materials used in the 14 layer rigid-flex PCB with 4 layer flex PCBs are FR4 (Tg – 135C, 145C, 170C), Rogers Ultralam 2000, Polyimide, Teflon, Black FR4, Arlon AR350, Getek Copper Clad Thermal Substrates, and Nelco 4013. Also, we use Green/Green, Matte White, Black/Black, Matte Clear, Blue Top and Bottom Mix, Red One or Both Sides Mix solder colors in their making.

In order to withstand the corrosion prone and other adverse industrial environments, these rigid-flex printed circuit boards are provided with HASL – Leaded Solder Tin/Nickel, Electroless Soft Gold, Wire Bondable Soft Gold, Nickel Flash Gold, Electrolytic Nickel /Hard Gold and Selective finishes, among others. Moreover, we are also the experts in manufacturing 14 layer rigid-flex PCB with 4 layer flex PCBs with the core thickness of minimum .0025″, minimum conductor space 0.003″, minimum conductor width 0.003″, and minimum drill hole size 0.006″.

When you buy 14 layer rigid-flex PCB with 4 layer flex from Rigiflex, you can be assured with built-to-suit rigid-flex with the unmatched quality delivered in the quick turnaround (Quick Turn 1-5 days and StandardLead Time 3-4 weeks). With all relevant industry certifications and registrations, our rigid-flex PCBs are manufactured for precise functioning. Leveraging the skills of our qualified team of professionals and advanced manufacturing facilities, we committed to delivering only high performing circuit boards.

14 Layer Rigid-Flex
Specifications Technology
Board Materials

FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Black FR4
Arlon AR350
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
Metal Core Materials

Thermo Set and PSA Based Aluminum
Stainless Steel
Final PCB Thickness

2 Layer – Min .005″ Max .250″
4 Layer – Min .015″ Max .250″
6 Layer – Min .025″ Max .250″
8 Layer – Min .031″ Max .250″
10 Layer – Min .040″ Max .250″
12 Layer – Min .047” Max .250”
14 Layer – Min .054″ Max .250″
16 Layer – Min .062″ Max .250″
18 Layer – Min .093″ Max .250″
20 Layer – Min .125″ Max .250″
22 Layer – Min .125″ Max .250″
>24 Layer – Min .125″ Max .250″
Core Thickness

Min .0025″
Maximum PCB Size
2 Layer 20″ x 28″
Mulitlayer 16″ x 26″
Minimum Conductor Space 0.003″
Minimum Conductor Width 0.003″
Minimum Drill Hole Size 0.006″
Finish Plating / Surface Finishes
HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
Finished Copper – Outer Layers
1oz Cu – Min .004″ Trace/Space
2oz Cu – Min .005″ Trace Space
3oz Cu – Min .008″ Trace/Space
4oz Cu – Min .010″ Trace/Space
5oz Cu – Min .012″ Trace/Space
Finished Copper – Inner Layers
.5oz Cu – Min .004″ Trace/Space
1oz Cu – Min .005″ Trace/Space
2oz Cu – Min .006″ Trace/Space
3oz Cu – Min .010″ Trace/Space
4oz Cu – Min .012″ Trace/Space
Inner Layer Clearances
Min .008″
Minimum Finished Hole Size
Final Thickness 062″ – .006” Hole Final Thickness .150″ – .014″ Hole
Final Thickness .093″ – .010″ Hole Final Thickness .200″ – .018″ Hole
Final Thickness .125″ – .012″ Hole Final Thickness .250″ – .020″ Hole
Gold Fingers
Per IPC-SM-840
LPI Soldermask
Peelable Soldermask
Solder Mask Colors
Matte White
Matte Clear
Blue Top and Bottom Mix
Red One or Both Sides Mix
Silkscreen Type
Thermal Cure Epoxy Ink
Silkscreen Colors
Yellow Top and Bottom Mix
Red One or Both Sides Mix
CNC Functions
Scoring Edge to Edge Plated Counter bores
Skip Scoring – .250″ Spacing Milling
30 or 60 Degree Score Angle Blind and Buried Vias
30 to 100 Degree Countersink Controlled Z Axis Route
15 to 45 Degree Gold Finger Bevel Castellated Barrels
Counterbores Offset or Recessed Beveling
Plated Countersinks
Other PCB Services
Blind and Buried Vias
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Solder mask Plugged Vias Via Caps (Solder Mask)
Conductive Filled Vias
Quality / Testing
Inspect to IPC Class III Continuity Resistance – 10 to 20 Ohms
Net List Test per IPC-356D Isolation Resistance – 2 to 30 Megaohms
Test Voltage – 100 to 250 Volts Minimum SMT Pitch 0.5 mm
PTH Hole Size – +/- .002″
Front to Back – +/- .002″
NPTH Hole Size – +/- .001″
Solder Mask – +/- .002″
Tooling Holes – +/- .001″
Hole to Pad – +/- .005″

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