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16 Layer Rigid-Flex PCB with 12 Layer Flex PCB Book Binding

Rigid-flex PCBs are an integral part of electronic applications because they combine rigid and flexible technologies. These printed circuit boards feature several layers of flexible circuit substrates attached to a rigid board. As the name suggests, the rigid-flex circuit boards offer both – flexibility and rigidity, which are important requirements in several applications. At Rigiflex Technology, Inc., we provide rigid-flex PCBs in different specifications and unique designs such as a 16-layer rigid-flex PCB with 12-layer flex PCB bookbinding.

The circuit bookbinding helps increase the length of the circuit in an outward direction from the bend radius. This length addition is influenced by different factors such as the tightness of the bend or number of layers of the circuit. This method helps avoid the bending of the circuit in different directions and channelizes it to only one direction. It also releases tension from the different circuit layers, and helps prevent buckling at the bend radius.

We can provide 16-layer rigid-flex printed circuit boards with 12-layer flex PCB bookbinding in different specifications. These PCBs are made from a wide range of board materials such as FR4, Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003, black FR4, Arlon AR350, and more. We use different types of connectors to terminate the extreme ends of flexible PCBs. In many cases, we also use stiffeners for termination. Thermo Set and PSA based aluminum, FR4, stainless steel, and polyamide are some of the common stiffeners used by us. We understand that the current requirements of these 16-layer rigid-flex PCBs will vary across different applications. Copper thickness is one of the important factors contributing to the current carrying capacity of these PCBs. Knowing this, we design these PCBs in different copper thicknesses from 1 Oz to 5 Oz for outer layers, and from 0.5 Oz to 4 Oz for inner layers. The copper traces are masked with a thin lacquer-like polymer layer to protect it against oxidation. We provide these PCBs in different solder mask colors such as green/green, matte white, black/black, matte clear, blue top and bottom mix, red one or both sides mix, and so on.

Over the years, we have invested in technologies and expertise, which allows us to take complex printed circuit board projects, and complete them in the shortest turnaround times. Do you have any complex rigid-flex circuit board design in mind? Our experts will work with you to understand your requirements, while suggesting you the right materials and specifications. At Rigiflex, our objective is delivering you the highest-quality products at competitive prices.

16 Layer Rigid-Flex
Specifications Technology
Board Materials
FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Black FR4
Arlon AR350
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
Metal Core Materials
Thermo Set and PSA Based Aluminum
Stainless Steel
Final PCB Thickness
2 Layer – Min .005″ Max .250″
4 Layer – Min .015″ Max .250″
6 Layer – Min .025″ Max .250″
8 Layer – Min .031″ Max .250″
10 Layer – Min .040″ Max .250″
12 Layer – Min .047” Max .250”
14 Layer – Min .054″ Max .250″
16 Layer – Min .062″ Max .250″
18 Layer – Min .093″ Max .250″
20 Layer – Min .125″ Max .250″
22 Layer – Min .125″ Max .250″
>24 Layer – Min .125″ Max .250″
Core Thickness
Min .0025″
Maximum PCB Size
2 Layer 20″ x 28″
Mulitlayer 16″ x 26″
Minimum Conductor Space 0.003″
Minimum Conductor Width 0.003″
Minimum Drill Hole Size 0.006″
Finish Plating / Surface Finishes
HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
Finished Copper – Outer Layers
1oz Cu – Min .004″ Trace/Space
2oz Cu – Min .005″ Trace Space
3oz Cu – Min .008″ Trace/Space
4oz Cu – Min .010″ Trace/Space
5oz Cu – Min .012″ Trace/Space
Finished Copper – Inner Layers
.5oz Cu – Min .004″ Trace/Space
1oz Cu – Min .005″ Trace/Space
2oz Cu – Min .006″ Trace/Space
3oz Cu – Min .010″ Trace/Space
4oz Cu – Min .012″ Trace/Space
Inner Layer Clearances
Min .008″
Minimum Finished Hole Size
Final Thickness 062″ – .006” Hole Final Thickness .150″ – .014″ Hole
Final Thickness .093″ – .010″ Hole Final Thickness .200″ – .018″ Hole
Final Thickness .125″ – .012″ Hole Final Thickness .250″ – .020″ Hole
Gold Fingers
Per IPC-SM-840
LPI Soldermask
Peelable Soldermask
Solder Mask Colors
Matte White
Matte Clear
Blue Top and Bottom Mix
Red One or Both Sides Mix
Silkscreen Type
Thermal Cure Epoxy Ink
Silkscreen Colors
Yellow Top and Bottom Mix
Red One or Both Sides Mix
CNC Functions
Scoring Edge to Edge Plated Counter bores
Skip Scoring – .250″ Spacing Milling
30 or 60 Degree Score Angle Blind and Buried Vias
30 to 100 Degree Countersink Controlled Z Axis Route
15 to 45 Degree Gold Finger Bevel Castellated Barrels
Counterbores Offset or Recessed Beveling
Plated Countersinks
Other PCB Services
Blind and Buried Vias
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Solder mask Plugged Vias Via Caps (Solder Mask)
Conductive Filled Vias
Quality / Testing
Inspect to IPC Class III Continuity Resistance – 10 to 20 Ohms
Net List Test per IPC-356D Isolation Resistance – 2 to 30 Megaohms
Test Voltage – 100 to 250 Volts Minimum SMT Pitch 0.5 mm
PTH Hole Size – +/- .002″
Front to Back – +/- .002″
NPTH Hole Size – +/- .001″
Solder Mask – +/- .002″
Tooling Holes – +/- .001″
Hole to Pad – +/- .005″

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