(714) 688-1500 pcboards@rigiflex.com
Flex & Rigid-Flex PCBs.. 1-5 Day Quick Turn
Flex & Rigid-Flex PCBs.. 1-5 Day Quick Turn
Superior & Trusted Flexible, Rigid-Flex & Rigid PCBs for Over 25 years
Rigiflex provides rigid-flex printed circuit boards in various standard and custom specifications. These printed circuit boards are used regularly in industries such as power, automobile, telecommunication and lighting. Rigiflex’s six-layered rigid-flex printed circuit boards have gained popularity over the years. These printed circuit boards are known to offer flexibility, as well as design freedom to PCB engineers.
A six-layered rigid-flex circuit board comprises 6 conductive layers, and are fabricated in a variety of sizes up to 18″ x 24″, and in board thicknesses 0.5mm~3.0mm (0.02″~0.12″). The outlines are created using methods such as punching, routing, and V-cut. We employ only laser drilling to create holes, which enables us achieve holes as small as 0.004″, and minimum finish thickness 0.3mm (flex), 1.6mm.
The conductive layers of this PCB are created using copper. We use various types of copper to meet the diverse application needs. Annealed copper is mostly used in applications that demand repeated movement of the printed circuit board. The circuit boards can be availed in various thicknesses ranging from 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ.
| 6 Layer Rigid-Flex PCB | |
| Model: | Rigid-flex board-6L |
| Layers: | 6 |
| Material: | FR4+Polyimide |
| Surface treatment: | HARD GOLD+ENIG |
| Width/space: | 4/4 mil |
| Finish thickness: | 0.3mm(flex),1.6mm |
| Min Hot: | 0.3mm |
Rigiflex provides rigid-flex printed circuit boards in various standard and custom specifications. These printed circuit boards are used regularly in industries such as power, automobile, telecommunication and lighting. Rigiflex’s six-layered rigid-flex printed circuit boards have gained popularity over the years. These printed circuit boards are known to offer flexibility, as well as design freedom to PCB engineers.
A six-layered rigid-flex circuit board comprises 6 conductive layers, and are fabricated in a variety of sizes up to 18″ x 24″, and in board thicknesses 0.5mm~3.0mm (0.02″~0.12″). The outlines are created using methods such as punching, routing, and V-cut. We employ only laser drilling to create holes, which enables us achieve holes as small as 0.004″, and minimum finish thickness 0.3mm (flex), 1.6mm.
The conductive layers of this PCB are created using copper. We use various types of copper to meet the diverse application needs. Annealed copper is mostly used in applications that demand repeated movement of the printed circuit board. The circuit boards can be availed in various thicknesses ranging from 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ.
| OEM Custom Service | |
| Board Thickness | 0.5mm~3.0mm (0.02″~0.12″) |
| Copper thickness: | 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ |
| Outline: | Routing, punching, V-Cut |
| Solder mask: | White/Black/Blue/Green/Red, Taiyo PSR4000 white |
| Legend/Silkscreen Color: | Black/White |
| Surface finishing: | Immersion Gold, HASL, OSP |
| Max Panel size: | 18″*24″ |
| Packing: | Vacuum/Plastic bag |
| Layer: | 1 – 20 layers |
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SPECIFICATION |
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Materials |
Polyimide |
Polyester ( PET) |
Remark& |
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(Kapton) |
Test Method |
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1~20(Rigid-Flex & Multilayers FPC) |
1~2 |
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Single Sided |
0.050 mm |
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Double Sided |
0.075 mm |
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Drilling P.T.H. |
0.2 mm |
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Punching |
1.0 mm |
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Conductor Width (W) |
0.025 mm |
W0.5mm |
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Hole Diameter (H) |
0.05 mm (withP.T.H.0.1mm) |
H1.5mm |
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Accumulated Pitch (P) |
0.05 mm (Special0.03mm) |
P25mm |
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Outline Dimension (L) |
0.05 mm |
L50 mm |
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Conductors and Outline (C) |
0.15 mm (Special 0.07mm) |
C5.0 mm |
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Conductors and Coverlay |
0.3~0.5 mm |
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Surface Treatment on |
Soft or Hard Ni/Au Sn/Pb (2~60µm) Primary FluxCarbon Printed 4~10µm Silver Gel printed |
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Terminals and land Areas |
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Insulation Resistance |
1000MW |
IPC-TM-650 2.6.3.2 |
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at Ambient |
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Dielectric Strength |
5KV |
IPC-TM-650 2.5.6.1 |
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Surface Resistance (W) |
5×012 |
2×015 |
IPC-TM-650 2.5.17 |
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Volume Resistivity (W-cm) |
1×015 |
1×015 |
IPC-TM-650 2.5.17 |
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Dielectric Constant (1 MHz) |
4 |
3.4 |
IPC-TM-650 2.5.5.3 |
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Dissipation Factor (1 MHz) |
0.04 |
0.02 |
IPC-TM-650 2.5.5.3 |
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Peeling Strength (180 irection) |
1.2kgf/cm |
1.2kgf/cm |
IPC-TM-650 2.4.9 |
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Solder Heat Resistance |
260 .C/10secs |
210 .C/3secs |
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Flammability |
94 V-0 |
94VTM-0 |
UL94 |
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Water Absorption |
2.90% |
1.00% |
ASTM D570% |
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(24 Hours) |
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