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6 Layer Rigid-Flex PCB with Selective Gold and Solder Plating

Rigid-flex PCBs are widely used in various static and dynamic flexing applications owing to several advantages that they offer. These PCBs feature rigid boards as well as flexible components that are connected using plated through-holes. Rigiflex Technology, Inc. is one of the leading manufacturers of rigid-flex PCBs. Over the years, we have designed and delivered rigid-flex PCBs in multiple layers for use in aggressive environments such as aerospace, automotive, military, and so on. Among them, the 6-layer rigid-flex PCB with selective gold and solder plating is one of the most popular rigid-flex PCBs provided by us. Comprising 6 layers, these PCBs are made of FR4+ polyimide material.

Rigid-flex PCBs are mainly used in harsh and abrasive environments. There is a high level of chemical precipitation in such environments. To mitigate this problem, we create rigid-flex PCBs with gold and solder plating. We help clients to choose from ENIG or hard gold surface finishes. Selective solder plating used on the PCBs serve as a perfect etch resistant in acidic conditions. Additionally, the gold and solder plating helps improve the overall strength as well as resistance of the PCB in harsh conditions. These elements also help increase its performance and overall shelf life.

6 Layer Rigid-Flex PCB with Selective Gold and Solder Plating
Model: Rigid-flex board-6L
Layers: 6
Material: FR4+Polyimide
Surface treatment: HARD GOLD+ENIG
Width/space: 4/4mil
Finish thickness: 0.3mm(flex),1.6mm
Min Hot: 0.3mm
OEM Custom Service
Board Thickness :0.5mm~3.0mm (0.02″~0.12″)
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline: Routing, punching, V-Cut
Solder mask: White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size: 18″*24″
Packing: Vacuum/Plastic bag
Layer: 1 – 20 layers

We also provide rigid-flex PCBs in 1-20 layers, and in board thickness from 0.5mm~3.0mm (0.02″~0.12″). Copper is one of the most common elements used for creating traces owing to its high conductivity. These traces carry electric signals to various components across the PCB, thereby contributing to its functioning. At Rigiflex, we can easily design PCBs in different copper thicknesses such as 0.5 Oz, 1.0 Oz, 2.0 Oz, 3.0 Oz, up to 6 Oz. These circuit boards are available in different solder mask colors including white, black, blue, green, red, and Taiyo PSR4000 white. The PCBs are also provided in legendary silkscreen colors black and white. These rigid flex PCBs can be availed in maximum panel size of 18″*24″. We can provide them in plastic bag/vacuum packaging that prevents damage during the transit. Do you want to design any single-sided, double-sided or multilayer PCBs? You can contact us at the earliest. Our experts will work with you to understand your application requirements before suggesting you the right configuration and dimensions. Our ability to design high-quality flexible printed circuit boards, rigid printed circuit boards, or rigid-flex printed circuit boards at the fastest turnaround times has helped us emerge as one of the leading PCB manufacturing services in the US.

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

1~20(Rigid-Flex &
Multilayers FPC)

1~2

 

Single Sided

0.050 mm

 

Double Sided

0.075 mm

 

Drilling P.T.H.

0.2 mm

 

Punching

1.0 mm

 

Conductor Width
(W)

0.025 mm

W0.5mm

Hole Diameter (H)

0.05 mm
(withP.T.H.0.1mm)

H1.5mm

Accumulated Pitch
(P)

0.05 mm
(Special0.03mm)

P25mm

Outline Dimension
(L)

0.05 mm

L50 mm

Conductors and Outline
(C)

0.15 mm (Special
0.07mm)

C5.0 mm

Conductors and
Coverlay

0.3~0.5 mm

 

Surface Treatment
on

Soft or Hard Ni/Au Sn/Pb
(2~60µm)

Primary FluxCarbon
Printed

4~10µm Silver Gel
printed

 

Terminals and land
Areas

Insulation
Resistance

1000MW

IPC-TM-650
2.6.3.2

at Ambient

Dielectric
Strength

5KV

IPC-TM-650
2.5.6.1

Surface Resistance
(W)

5×012

2×015

IPC-TM-650
2.5.17

Volume Resistivity
(W-cm)

1×015

1×015

IPC-TM-650
2.5.17

Dielectric Constant (1
MHz)

4

3.4

IPC-TM-650
2.5.5.3

Dissipation Factor (1
MHz)

0.04

0.02

IPC-TM-650
2.5.5.3

Peeling Strength (180
irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650
2.4.9

Solder Heat
Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)

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