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12 Layer Rigid Polyimide PCB with Heat Sink


This 12 layer rigid PCB is designed to be used in high stress and temperature applications. Polyimide is used as one of the main materials as it is an organic material that provides immense heat resistance. Gold is used as the surface finish material because it helps the PCB remain stable even in harsh application environments. We have added heat sink so the PCB can dissipate heat easily in high temperature applications. This PCB has the capabilities to reach thermal stresses up to 288℃ & 20 Sec. Impedance control tolerance is at +/-10%. For custom PCB designs, we provide varied surface finish options such as carbon ink, lead free HASL, immersion tin and silver, and OSP.

There are certain applications in which, the printed circuit boards may get heated up, if proper heat dissipation is not done. Using a heat sink on the PCBs help dissipate the heat generates in the application efficiently. Equipped with a heat sink, our PCBs are specially designed to suit high temperature, and high-stress applications.

12 Layer Rigid Polyimide PCB with Heat Sink
Model: 12L PCB
Base Material: 12L,FR4, TG170
Board Thickness: 2.0 mm
Copper Thickness: 1/H…H/1OZ
Min. Hole Size: 3mil (0.076mm)
Min. Line Width/ Spacing: 3/3 mil
Solder mask/ Silkscreen Color: Green/White
Surface Finishing: Gold

As the 12 layer rigid printed circuit boards comes with a heat sink, they have the capability to reach exceptional thermal stresses up to 288 °C and 20 Sec. The best property of these PCBs is that they have an exceptional ± 10% impedance control tolerance. You can get your PCB custom designed with a variety of surface finish options to choose from, including carbon ink, lead-free HASL, immersion tin and silver, and OSP. However, we recommend using gold as a surface finish, as it will help the PCB in delivering a consistent and stable performance even in unfriendly application environments. The base material used in these PCBs is 12L, FR4, TG170.

At Rigiflex, the quality of a product delivered is of utmost importance for us. Thus, the 12 layer rigid polyimide PCBs that we manufacture are of highest industry standards. Also, we make these high-quality printed circuit boards available at most competitive, and affordable prices in the US. Let us know your requirements, and our team of skilled, experienced, and knowledgeable staff will help you design and manufacture PCB that is an exact match to your specifications.

Rigid PCB Capability
No. Item Technical data
1 Layer Count 1-30Layers
2 HDI Type 1+N+1, 2+N+2
3 Material CEM3, FR-4, Halogen Free, Aluminum-based, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide etc
4 Board thickness 0.2~5.0mm
5 Board Size Max. 18”x24”
Min. 30x50mm
6 Copper Thickness Outer layer 1oz~6oz
Inner layer Hoz~5oz
7 Min. Line Width/Space 4/4mil(0.1/0.1mm)
8 Finished Hole size Mechanical 0.20~6.30mm
Laser 5mil, 6mil
9 Blind/buried via(Mechanical) 0.2mm (min)
10 Aspect Ratio 10:1
11 Hole Dia.Tolerance PTH ±0.075mm(3mil)
NPTH ±0.05mm (2mil)
12 Hole Position Tolerance ±0.05mm (2mil)
13 Bow & Twist ≤0.75%
14 Peel strength 1.4N/mm
15 Thermal stress 288℃ & 20 Sec
16 Test Voltage 50-300V
17 Soldermask color Green, Red, Blue, Black, White
18 Silkscreen color White, Black, Yellow
19 Min. S/M Pitch 4mil(0.1mm)
20 Min. Solder Mask Clearance 0.05mm
21 Impedance Control Tolerance +/-10%
22 Outline Tolerance ±0.10mm (4mil)
23 Surface Finish HASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask

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