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14 Layer Rigid Flex Circuit Boards with Gold and Solder Plating

Rigiflex is one of the leading and experienced manufacturers of rigid-flex printed circuit boards (PCBs) in the US. We add gold plating to the PCBs, which helps strengthen the design and manufacture of the PCBs. Gold plating is most commonly done for edge connectors, as well as membrane switches. If you want to protect the components of your PCBs from wear and tear, and make them last for several years together, then electroplated gold at 300 micro inches is used. We also provide rigid PCBs with solder plating to enhance the imaging process. Solder plating is only applicable to those boards that are not coated with solder masks. Also, solder plating can be done on those boards, over which components are hand soldered and assembled. If proper maintenance is done, then this solder plating has the capability to last for a number of years.

The 14 layer rigid-flex circuit boards that we manufacture come with gold and solder plating. The surface finishing of these printed circuit boards is of gold. However, you can also select from other surface finish options, which include HASL, lead-free HASL, Immersion Gold/Tin/Silver, OSP, flash gold, gold fingers, plating hard gold, and peelable mask. We have the capability to provide you 14 layer rigid-flex circuit boards with a total board thickness of 2.0 mm. The base material used for these circuit boards is FR4 TG170, which is a glass fabric-based epoxy resin copper clad laminate. The minimum solder mask clearance that we provide is 0.05 mm.

14 Layer Rigid Flex Circuit Boards with Gold and Solder Plating
Model 14L PCB
Base Material: 14L,FR4, TG170
Board Thickness: 2.0 mm
Copper Thickness: 1/H…H/1OZ
Min. Hole Size: 3mil (0.076mm)
Min. Line Width/ Spacing: 3/3 mil
Solder mask/ Silkscreen Color: Green/White
Surface Finishing: Gold
Rigid PCB Capability
No. Item Technical data
1 Layer Count 1-30Layers
2 HDI Type 1+N+1, 2+N+2
3 Material CEM3, FR-4, Halogen Free, Aluminum-based, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide etc
4 Board thickness 0.2~5.0mm
5 Board Size Max. 18”x24”
Min. 30x50mm
6 Copper Thickness Outer layer 1oz~6oz
Inner layer Hoz~5oz
7 Min. Line Width/Space 4/4mil(0.1/0.1mm)
8 Finished Hole size Mechanical 0.20~6.30mm
Laser 5mil, 6mil
9 Blind/buried via(Mechanical) 0.2mm (min)
10 Aspect Ratio 10:1
11 Hole Dia.Tolerance PTH ±0.075mm(3mil)
NPTH ±0.05mm (2mil)
12 Hole Position Tolerance ±0.05mm (2mil)
13 Bow & Twist ≤0.75%
14 Peel strength 1.4N/mm
15 Thermal stress 288℃ & 20 Sec
16 Test Voltage 50-300V
17 Soldermask color Green, Red, Blue, Black, White
18 Silkscreen color White, Black, Yellow
19 Min. S/M Pitch 4mil(0.1mm)
20 Min. Solder Mask Clearance 0.05mm
21 Impedance Control Tolerance +/-10%
22 Outline Tolerance ±0.10mm (4mil)
23 Surface Finish HASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask

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