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6 Layer Rigid PCB Polyimide with Step down Finger on Layer 3

At Rigiflex, we have been manufacturing various types of rigid-flex printed circuit boards (PCBs) for several years now. This has given us an understanding of the exact requirements of our customers. Along with the several rigid-flex PCBs, we have the capability to provide the 6 layer rigid polyimide PCB with step down finger on layer 3. The step down fingers are basically used as connectors, and are lined up along the edge of the substrate. These step down fingers are also referred to as contact fingers. The primary function of these contact fingers is to connect a PCB to another PCB or other electronic devices.

The 6 layer rigid PCB that we provide is made from the polyimide material, owing to its favorable and beneficial properties. The material has a great thermal stability, excellent chemical resistance, amazingly heat resistant, and good mechanical properties. The total board thickness of the circuit board is 1.6 mm. The copper thickness of this printed circuit board is 1 OZ. We have the capability to provide a minimum hole size of 4 mil (0.1 mm) for these PCBs. We use gold as the primary surface finish for the manufactured circuit board. At Rigiflex, the surface finishes for step down fingers is performed using different raw materials, such as lead-free HASL, immersion tin, or gold. These rigid printed circuit boards can be mounted as Plated-through Holes (PTH) or Non Plated-through Holes (NPTH). If you choose to go with the PTH, then the hole diameter is ±0.075mm. On the other hand, for the NPTH option, the diameter of the hole is ±0.05mm. The soldermask color can be selected by the customer from a variety of color options, which include white, blue, black, red, or green.

6 Layer Rigid PCB Polyimide with Step down Finger on Layer 3
Model: 6L PCB
Base Material: 6L, FR4,TG135
Board Thickness: 1.6 mm
Copper Thickness: 1OZ
Min. Hole Size: 4mil (0.1mm)
Min. Width/Gap: 4/5 mil
Surface Finishing: Gold
Rigid PCB Capability
No. Item Technical data
1 Layer Count 1-30Layers
2 HDI Type 1+N+1, 2+N+2
3 Material CEM3, FR-4, Halogen Free, Aluminum-based, Teflon, Rogers, Getek, Nelco, PTFE, Polyimide etc
4 Board thickness 0.2~5.0mm
5 Board Size Max. 18”x24”
Min. 30x50mm
6 Copper Thickness Outer layer 1oz~6oz
Inner layer Hoz~5oz
7 Min. Line Width/Space 4/4mil(0.1/0.1mm)
8 Finished Hole size Mechanical 0.20~6.30mm
Laser 5mil, 6mil
9 Blind/buried via(Mechanical) 0.2mm (min)
10 Aspect Ratio 10:1
11 Hole Dia.Tolerance PTH ±0.075mm(3mil)
NPTH ±0.05mm (2mil)
12 Hole Position Tolerance ±0.05mm (2mil)
13 Bow & Twist ≤0.75%
14 Peel strength 1.4N/mm
15 Thermal stress 288℃ & 20 Sec
16 Test Voltage 50-300V
17 Soldermask color Green, Red, Blue, Black, White
18 Silkscreen color White, Black, Yellow
19 Min. S/M Pitch 4mil(0.1mm)
20 Min. Solder Mask Clearance 0.05mm
21 Impedance Control Tolerance +/-10%
22 Outline Tolerance ±0.10mm (4mil)
23 Surface Finish HASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask

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